ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 1 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com applications ? mobile infrastructure ? catv / fttx ? w - lan / ism ? wcdma / lte ag602g sot - 89 packa ge product features ? dc ? C ? 3500 ? mhz ? +18.5 ? dbm p1db at 900 ? mhz ? +33 ? dbm oip3 at 900 ? mhz ? 14? db gain at 900 ? mhz ? single voltage supply ? sot - 89 p ackage ? internally m atched to 50 ? ? general description the ag602 - 89 g is a general - purpose buffer amplifier that offers high dynamic ran ge in a low - cost , surface - mount package. at 900 ? mhz, the ag602 - 89 typically provides 14 ? db of gain, +33 ? dbm oip3, and +18.5 ? dbm p1db. th is amplifier combines dependable performance with consistent quality to maintain an mttf exceeding 1000 years at mounti ng temperatures of +85? c . the ag602 - 89g consists of darlington pair amplifiers using the high reliability ingap/gaas hbt process technology and only requires dc - blocking capacitors, a bias resistor, and an inductive rf choke for operation. the broad band mmic amplifier can be directly applied to various current and next generation wireless technologies such as gsm, cdma, w - cdma and lte . in addition, the ag602 - 89 will work for other various applications within the dc to 3.5 ghz frequency range such as catv . the ag602 - 89g is housed in a lead - free/green/rohs - compliant sot - 89 industry - standard smt package. pin configuration pin no. label 1 rf in 2 gnd 3 rf out?/?v cc backside paddle gnd ordering information part no. description ag602 - 89g ingap/gaas hbt gain block ag602 - 89 pcb 700 - 2 400 m hz evaluation board standard t/r size = 30 00 pieces on a 13 reel functional block diagram rf in gnd rf out / v cc 1 2 3 backside paddle - gnd
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 2 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com recommended o perating conditions parameter min typ max units t case ? 40 +85 c tj for >10 6 hours mttf + 177 c electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. absolute maximum ratings parameter rating storage temperature ? 55 to 150 ? c rf input power, cw, 50 ? , t=25 ? c + 10 dbm device voltage (v cc ) + 7 v operation of this device outside the parameter ranges g iven above may cause permanent damage. electrica l specifications test conditions unless otherwise noted: v supply =+6 ? v, r bias =11.2 ? , i cc = 75?ma (typ.) , t case = +25 ? c, 50? system parameter conditions min typ max units operational frequency range dc 3500 mhz gain f=900 ? mhz 14.2 db f=1900 ? m hz 12.6 13.6 14.6 db input return loss 13 db output return loss 15 db output p1db f=900 ? mhz +18.7 dbm f=1900 ? mhz +18.4 dbm output ip3 pout= +2 ? dbm/tone, f= 1 0 mhz f=900 ? mhz +33.1 db m f=1900 ? mhz +33.0 db m output ip2 +47 dbm noi se figure 4.4 db device voltage ( v cc ) 5.16 v device current (i cc ) 75 ma thermal resistance , ( jc ) junction to case (1) 154 c/w notes: 1. thermal path is from the device junction to the backside paddle .
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 3 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com s - parameters test conditions: v c c =+5 .16 ? v (typ.), i cc = 75 ? ma (typ.), t case =+25 ? c, 50 ? system, calibrated to device leads freq ( m hz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 - 12.45 - 179.91 14.65 177.68 - 18.47 0.30 - 18.85 - 178.44 250 - 12.80 173.14 14.6 4 168.81 - 18.89 - 0.92 - 18.64 - 178.50 500 - 11.98 161.40 14.50 157.67 - 18.95 - 8.53 - 16.31 - 178.33 750 - 12.30 151.47 14.40 146.73 - 18.97 - 11.88 - 16.00 - 176.91 1000 - 13.15 140.39 14.28 136.05 - 19.19 - 19.66 - 15.76 - 176.74 1250 - 13.66 132.83 14.17 125.29 - 18 .81 - 22.16 - 15.26 - 175.58 1500 - 14.64 123.63 14.01 114.91 - 18.86 - 24.27 - 15.11 - 174.90 1750 - 15.97 112.75 13.85 104.18 - 18.94 - 28.63 - 14.80 - 175.62 2000 - 17.11 96.84 13.66 93.65 - 18.68 - 33.27 - 14.28 - 177.69 2250 - 16.83 69.35 13.46 83.50 - 18.54 - 37.00 - 13.75 - 168.13 2500 - 17.16 59.34 13.32 75.95 - 19.15 - 44.64 - 13.33 - 178.03 2750 - 16.62 55.01 13.10 65.23 - 18.55 - 48.27 - 13.21 168.67 3000 - 15.52 52.50 12.84 54.89 - 18.59 - 51.43 - 12.58 151.61 3250 - 14.36 50.49 12.59 44.74 - 18.62 - 55.38 - 11.68 133.62 3500 - 12.98 48.86 12.26 34.37 - 18.77 - 61.67 - 10.45 117.29 3750 - 11.45 46.31 11.88 24.22 - 18.67 - 67.58 - 9.21 103.08 4000 - 10.56 43.88 11.51 14.12 - 18.75 - 72.12 - 8.31 91.70 4250 - 9.85 41.17 11.18 4.58 - 18.49 - 77.01 - 7.57 81.65 4500 - 9.57 37.68 10.85 - 5.08 - 1 8.56 - 82.75 - 7.25 72.53 4750 - 9.72 34.04 10.64 - 15.21 - 18.35 - 87.23 - 7.09 64.42 5000 - 9.99 28.26 10.44 - 25.10 - 18.54 - 92.28 - 7.07 56.77 5250 - 10.47 20.24 10.28 - 35.32 - 18.23 - 100.76 - 7.28 47.25 5500 - 10.65 10.13 10.00 - 46.33 - 17.94 - 107.33 - 7.18 37.35 5750 - 10.11 - 0.98 9.79 - 57.68 - 17.99 - 114.40 - 6.88 24.19 6000 - 8.96 - 13.41 9.41 - 69.50 - 18.15 - 123.08 - 6.18 10.75
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 4 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com ag602 - 89pcb evaluation board r4 c1 c2 c3 l1 u1 j3 j4 u1 j2 rf output j4 gnd j3 v cc 1 2, backside paddle 3 j1 rf input l1 c2 c1 c3 c4 r4 notes: 1. see evaluation board pcb information section for material and stack - up. 2. all components are 0 603 size unless otherwise stated. bill of material ? ag602 - 89pcb reference des. value description manuf. part number u 1 n/a ingap hbt gain block triquint ag602 - 89g l1 39 nh inductor, 0603, 5%, cs series coilcraft 0603cs - 39nxjl c1 , c2 56 pf cap, ch ip, 0603, 50v, npo, 5% various c3 0.018 uf cap, chip, 0603, 16v, x7r, 10% various c4 dnp do not populate r 4 11.2 res, chip, 0805, 1/10w, 1 % various recommended component values for specific frequencies frequency (mhz) 50 500 900 1900 2200 25 00 3500 l1 820 nh 220 nh 68 nh 27 nh 22 nh 18 nh 15 nh c1, c2 .018 uf 1000 pf 100 pf 68 pf 68 pf 56 pf 39 pf bias resistor values for various supply voltages v supply (v) 6 7 8 9 10 12 r1 11.2 24.5 38 51 65 91 component size 0805 1210 1 210 20 10 2010 2512 the proper value for r1 is dependent upon the supply voltage and allows for bias stability over temperature. a minimum supply voltage of +6 v is required . a 1% tolerance resistor is recommended.
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 5 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com typical performance ? ag602 - 89pcb test conditions unless otherwise noted: v supply =+6 ? v, r 1 = 11.2 ? , i cc = 75 ? ma (typ.) , t case = +25 ?c parameter typical value units frequency 1 00 500 900 1900 21 4 0 2 4 00 3500 5800 mhz gain 14.5 14.4 14.2 13.6 13.5 13.2 12.2 9.6 db input return loss 1 2 12 13 16 16 17 13 10 db output return loss 18 16 15 14 14 13 10 7 db output p1db +18.6 +18.6 +18.7 +18.4 +18.3 +18.3 +17.5 dbm output ip3 (1) +33.8 +33.5 +33.1 +33.0 +33.0 +33.0 dbm noise f igure 4.3 4.3 4.4 4.5 4.5 4.6 db notes: 1. oip3 measured wi th two tones at an output power of +2 ? dbm ?/? tone separated by 1 0 ? mhz. 2. data is shown as device performance only. actual implementation for the desired frequency band will be determined by external components shown in the application circuit. performance plots ? ag602 - 89pcb test conditio ns unless otherwise noted: v supply =+6 ? v, r 1 = 11.2 ? , i cc = 75 ? ma (typ.) , t case = +25 ?c 6 8 10 12 14 16 0 1 2 3 4 gain (db) frequency (ghz) gain vs. frequency +85 c +25 c ?40 c - 40 - 30 - 20 - 10 0 0 1 2 3 4 |s11|, |s22| (db) frequency (ghz) return loss vs. frequency |s22| |s11| 0 25 50 75 100 125 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 device current (ma) device voltage (v) i - v curve i cc vs. v cc optimal operating point (typ.) 20 25 30 35 40 0 0.5 1 1.5 2 2.5 3 oip3 (dbm) frequency (ghz) output ip3 vs. frequency +85 c +25 c ?40 c pout=+2 dbm/tone f= 10 mhz 35 40 45 50 55 60 0 200 400 600 800 1000 oip2 (dbm) frequency (mhz) output ip2 vs. frequency +85 c +25 c ?40 c 1 2 3 4 5 6 7 0 0.5 1 1.5 2 2.5 3 nf (db) frequency (ghz) noise figure vs. frequency +85 c +25 c ?40 c 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 p1db (dbm) frequency (ghz) p1db vs. frequency +85 c +25 c ?40 c 0 4 8 12 16 20 10 11 12 13 14 15 - 12 - 8 - 4 0 4 8 output power (dbm) gain (db) input power (dbm) output power / gain vs. input power gain output power freq.=900 mhz temp.=+25 c 0 4 8 12 16 20 4 6 8 10 12 14 - 12 - 8 - 4 0 4 8 output power (dbm) gain (db) input power (dbm) output power / gain vs. input power freq.=2000 mhz gain output power temp.=+25 c
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 6 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com performance plots ? ag602 - 89pcb test conditions unless otherwise noted: v supply ? = ? + 8 ? v, r 1 ? = ? 38 ? , i cc ? = ? 75 ? ma (typ.) , t case ? = ? +2 5 ?c 6 8 10 12 14 16 0 1 2 3 4 gain (db) frequency (ghz) gain vs. frequency +85 c +25 c ?40 c 20 25 30 35 40 0 0.5 1 1.5 2 2.5 3 oip3 (dbm) frequency (ghz) output ip3 vs. frequency +85 c +25 c ?40 c pout=+2 dbm/tone f= 10 mhz 42 44 46 48 50 52 0 200 400 600 800 1000 oip2 (dbm) frequency (mhz) output ip2 vs. frequency +85 c +25 c ?40 c 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 3.5 4 p1db (dbm) frequency (ghz) p1db vs. frequency +85 c +25 c ?40 c 1 2 3 4 5 6 7 0 0.5 1 1.5 2 2.5 3 nf (db) frequency (ghz) noise figure vs. frequency +85 c +25 c ?40 c
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 7 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com pin configuration and description rf in gnd rf out / v cc 1 2 3 backside paddle - gnd pin no. label description 1 rf in rf i nput, matched to 50 ohms. external dc block is required. 2, backside paddle gnd rf/dc ground. use recommended via pattern to minimize inductance and ther mal resistance. see pcb mounting pattern for suggested footprint. 3 rf out?/?v cc rf o utput / dc supply , matched to 50 ohms . external dc block , bias choke, and dropping resistor are required. evaluation board pcb information triquint pcb 10 69124 material and stack - up 1 oz. cu bottom layer nelco n-4000-13 core nelco n-4000-13 1 oz. cu top layer 1 oz. cu inner layer 1 oz. cu inner layer 0.062" 0.006" finished board thickness 0.014" 0.014" 50 ohm line dimensions: width=0.028" spacing=0.028"
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 8 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com package marking and dimensions 1.62 (.064) 4.40 (.173) .35 (.014) .36 (.014) .44 (.017) 1.40 (.055) d1 d c b1 b symbol a 4.60 (.181) 4.50 (.177) 1.83 (.072) 1.73 (.068) 1.60 (.063) max .44 (.017) .48 (.019) .56 (.022) .50 (.020) .40 (.016) .42 (.0165) 1.50 (.059) typ min 3.94 (.155) 2.13 (.084) 2.29 (.090) e h l e1 e1 e symbol 2.29 (.090) 2.60 (.102) 4.25 (.167) 1.20 (.047) 1.50 bsc (.059) 1.10 (.043) 4.10 (.161) 3.00 bsc (.118) 2.20 (.087) 2.50 (.098) max min .89 (.035) typ 7 b e e1 2x b1 e l h d1 d c e1 d1 d1 alternate backside patterns - reflow compatible (part may be supplied with either pattern) a half etching depth 0.001" n otes : 1. all dimensions are in millimeters (inches) . angles are in degrees. 2. dimension and tolerance formats conform to asme y14.4m - 1994. 3. the terminal #1 identifier and terminal numbering conform to jesd 95 - 1 spp -012. 4. contact plating: nipdau pcb mounting patte rn 2.54 (0.100) 2.11 (0.083) 2.48 (0.098) 0.76 (0.030) 0.76 (0.030) 0.38 (0.015) 7.62 (0.300) 1.27 (0.050) package outline 0.58 (0.023) 3.48 (0.137) 1.27 (0.050) 5.33 (0.210) 1.80 (0.071) 0.86 (0.034) 0.64 (0.025) 3.86 (0.152) 26x ?0.25 (0.010) 5 n otes : 1. all dimensions are in millimeters (inches) . angles are in degrees. 2. use 1 oz. copper minimum for top and bottom layer metal. 3. vias are required under the backside paddle of this device for proper rf/dc grounding and thermal dissipation. 4. do not remove or minimize via hole structure in the pcb. thermal and rf grounding is critical. 5. we recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10). 6. ensure good package backside padd le solder attach for reliable operation and best electrical performance. a602g yxxx package marking product identifier: a602g date /assembly code: yxxx
ag602 - 89g ingap hbt gain block datasheet: rev b 6/2 6 /1 4 - 9 of 9 - disclaimer: subject to change without notice ? 201 14 triquint www.triquint.com product compliance information esd sensitivity ratings caution! esd - sensitive device esd rating: class 1 c value: 1000 v and < 2 000 v test: human body model (hbm) standard: esda?/? jedec standard js - 001 - 2012 esd rating: class c3 value: passes 1000 v test: charged device model (cdm) standard: jedec standard jesd22 - c101 f solderability compatible with both lead - free (260c maximum reflow t emperature) and tin/lead (245c maximum reflow temperature) soldering processes. contact plating: nipdau rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical an d electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl rating: level 3 test: 260c convection reflow standard: jedec standard ipc/jedec j - std - 020 contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.tri quint.com tel: +1.503.615.9000 email: info - sales@t riquint .com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@ triquint .com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whats oever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the ent ire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. th e information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything describe d by such information. triquint products are not warranted or authorized for use as critical components in medical, life - saving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
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